The HiPak™ modules are high power IGBTs in industry standard housings with the popular 190 x 140 mm footprint. The initial ABB offering is for devices using Aluminium Silicon Carbide (AlSiC) base-plate material for excellent thermal cycling capability as required in traction applications and Aluminium Nitride (AlN) isolation for low thermal resistance.
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the blue part numbers. For further information please contact us.